Read Aloud the Text Content

This audio was created by Woord's Text to Speech service by content creators from all around the world.

Text Content or SSML code:

Good Day; thanks for visiting our poster; I am Navas, working in package development group, developing BGA packages for ATV products; I will share about high-performance package development with Thermally enhanced mold compound for next generation micro-controller products; This project is dealing with automotive microcontroller, so it would be interesting to know briefly about future car electronic control and automation architecture; Our customers and OEM are developing Zonal architecture. The Zonal microcontroller acts as local gateway; Only few powerful zonal microcontroller are connected to local ECU, sensors and actuators; Also Zonal microcontroller distributes power in the zone. These zonal microcontrollers are connected to central computer by high speed ethernet; some estimates are Zonal architecture reduces 30% wiring weight and cost; Infineon is developing Aurix third generation microcontroller for such application. The A3G is using advanced device nodes twenty-eight nanometre from TSMC; future generation will be using advanced nodes such as sixteen nanometre technology; Smaller the device node; more transistors can be packed on same chip area; processing speed is also higher; The package technology developed today should be suitable for future generation of products as well; There are three electrical factors are considered during package technology selection such as Power integrity, Signal integrity, power handling; Most common package type for micro-controller device is wire bond interconnect; but it is not suitable for high performance and higher power Microcontroller needed for Zonal architecture; We selected Flip chip package technology for the product to meet stringent IR drop and high speed interconnect impedance requirements; We co-worked with the assembly partner and developed two package concepts with fully encapsulated with epoxy mold compound; one with Lid and other without lid; Our assembly partners do not offer flip chip package for AEC reliability grade zero requirements; Therefore we have to finetune materials and processes to meet Grade zero reliability requirements. Overall package concept and material are passing reliability; but package heat dissipation or power handling is less than five watts; We are challenged to find a way to improve package thermal limit above five watts; We are under time pressure to find a solution to improve package thermal limit, before lead product design tape out within six months; Typically, twelve to eighteen months are needed for a new package development starting from material selection, manufacturability assessment, reliability test and data collection; We decided to keep the package concept; but only improve package material without compromising the reliability; We analyzed package thermal resistance by thermal simulation and how current package materials contributes to package thermal resistance; The substrate and encapsulant mold compound are major elements contribute to the thermal limit; Changing substrate material is not a good option considering development cycle time and its impacts to flip chip interconnect reliability; We focused on encapsulant mold compound material; based on thermal simulation we need a material with three to four fold higher conductivity than current material; We formed a three way collaboration Infineon, assembly partner and material supplier to develop the material; The material choices have been carefully considered; should be able to migrate into high volume grade quickly within few months; We decided to modify existing by adding alumina fillers without changing much of the resin system; because changing resin system will affect moldability, adhesion and package reliability significantly; We selected four materials for workability assessment, the material supplier has supported well for preparing the materials quickly from R and D line; We did first assessment of moldability, strip warpage, package warpage. Based on workability assessment two materials have been selected; We repeated the workability assessment with the two selected materials and collected time zero package responses. Both materials meet requirements; however one of them is preferred due to higher adhesion strength with the Lid; We prepared samples for quick reliability and subjected to them to accelerated reliability conditions and collected reliability data within 2 months; All the physical analysis after reliability stresses show no abnormality; we shared the results with assembly partner and material supplier. They did not see risk with the material and agreed to convert the material to production grade; The activity started in March 2022. The material screening, workability, reliability assessment and moving material into production grade are done by October 2022; Now I will share how our project add value to the business unit for profitability; The business unit had initially projected to use package with Lid for majority of product portfolio; Our project enabling thermally enhanced mold compound allows the business unit to select lower cost package without lid for ninety percent of products. Only ten percent of products require package with lid, which is one-dollar higher package cost; A conservative assessment of ten to fifteen million dollar saving to the business due to this development; Finally, I want to thank our colleagues who have supported this project; Thank you again for visiting our poster. Please contact me if you want more information about this topic.